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Corrosion testing of polyimide coated copper for semiconductor devices

机译:半导体器件用聚酰亚胺涂层的铜的腐蚀测试

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In the semiconductor industry, corrosion of metals that are incorporated into a chip may occur. Relevant factors contributing to corrosion are external influences, e.g.temperature, humidity and bias. The aim of this work to assess these external factors in their impact on corrosion of polyimide coated copper, which is built in to semiconductor devices.
机译:在半导体工业中,掺入芯片中的金属可能会发生腐蚀。导致腐蚀的相关因素是外部影响,例如温度,湿度和偏差。这项工作的目的是评估这些外部因素对内置于半导体器件中的聚酰亚胺涂层铜腐蚀的影响。

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