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Advanced 18 nm Quad-MTJ technology overcomes dilemma of Retention and Endurance under Scaling beyond 2X nm

机译:高级18 nm Quad-MTJ技术克服了超出2X NM的缩放下的保留和耐久性的困境

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Advanced quad-interfaces perpendicular magnetic tunnel junction (Quad-MTJ) was developed by engineering a low effective damping constant (αeff) material in free layer with high perpendicular magnetic anisotropy (PMA), and low resistance area product (RA) in MgO layers, and stable reference layer. The advanced 18 nm Quad-MTJ fabricated by the developed low-damage 300 mm fabrication process exhibited following performances over those of Double-MTJ; (a) 1.77 times larger thermal stability factor (Δ), (b) 0.83 times smaller writing current (Ic) at 10 ns, (c) 2.1 times higher write efficiency (Δ/Ic) at 10 ns. Thanks to the above excellent MTJ stack design, it is the first time beyond 2X nm generation that the advanced 18 nm Quad-MTJ achieves at least 6×1011 endurance with 10 years retention. Consequently, the advanced Quad-MTJ technologies have broken out the dilemma issue of retention and endurance even under scaling of 2X nm.
机译:先进的Quad接口垂直磁隧道结(Quad-MTJ)是通过工程为低有效阻尼常数(α)开发的(α eff )在自由层中的材料,具有高垂直的磁各向异性(PMA)和MgO层中的低电阻区域产品(RA),以及稳定的基准层。由开发的低损伤300mm制造过程制造的先进的18nm Quad-MTJ在双MTJ的性能下表现出来。 (a)热稳定因子(δ)的1.77倍,(b)写入电流较小的0.83倍(i c )在10 ns,(c)的写入效率高出2.1倍(δ/ i c )在10个ns。由于上述优秀的MTJ堆栈设计,它是高级18 nm Quad-MTJ的第一次获得至少6×10 11 耐力10年保留。因此,即使在2倍NM的缩放下,高级四分之一的技术技术也突破了保持和耐久性的困境问题。

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