INDUSTRY INTELLIGENCE FROM TEARDOWNS OF IOT AND WEARABLES

摘要

The impulse to break a new gadget to "see what's inside" is often the first sign someone will become an engineer. However, modern teardowns go far beyond pure curiosity: they provide us critical insights into the nature and construction of these devices. In this paper we will cover the teardown of several smartphone and wearable devices to understand how the SMT industry has changed. These findings will also help us forecast where we are going as a community by discussing miniaturization and packaging, automation and labor force location, device features, and other important topics. These are key issues we need to address to keep U.S. SMT manufacturing relevant.