Aerosol Jet Printing for printed electronics rapid prototyping

摘要

This work investigates optimization procedures for rapid prototyping with Aerosol Jet Printing by printing high quality structures for the fabrication of multi-layer passive devices on various substrates. The effects of gas flow rate, nozzle diameter, stage speed and substrate temperature are examined in order to optimize printed line width for each material. Inductors, capacitors and resistors are fabricated using silver nano-particle ink, SU-8 dielectric and PEDOT:PSS organic conductor. Further applications are show-cased by printing silver interconnect lines with fine pitch for various applications such as: replacement for die wirebonding, printing a strain gauge on a 3D conformal surface, and for printing on flexible plastic substrates.