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Three-dimensional Characterization of Gd Nanoparticles using STEM-in-SEM Tomography in a DualBeam FIB-SEM

机译:在双束FIB-SEM中使用STEM-in-SEM层析成像技术对Gd纳米粒子进行三维表征

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Serial sectioning using the FIB and subsequent imaging of the same FIB-exposed surface by both FIB microscopy and scanning electron microscopy (SEM) in a DualBeam has proven especially useful to study the three-dimensional (3D) morphology of complex engineered materials systems. The technique was first introduced as an automated process in 2004 and since then has established itself as one of the primary applications for FIB and DualBeams. While state-of-the-art systems can produce datasets with a z-axis slice thickness of 3-5 nm, FIB nanotomography remains a destructive technique and is limited in resolution by the z-axis slice thickness. Electron tomography is another technique used to visualize 3D structures within a transmission electron microscope used in TEM or STEM mode. Using a thin sample focused on a region of interest, the electron beam passes through the specimen incrementally tilting around the center of the region of interest as images are acquired sequentially on a camera (TEM) or a Detector (STEM). The resulting images are reconstructed into a 3D volume using a variety of algorithms including Weighted Back Projection (WBP), or Serial Iterative Reconstruction Technique (SIRT). Low energy STEM in SEM is a routine analysis in SEMs and DualBeam FIB-SEM instrumentation for morphological characterization and ultra high-resolution imaging. With a DualBeam or SEM configured with a solid state silicon diode STEM detector and a stage with adequate tilt freedom, it is possible to acquire a sufficient number of images for 3D reconstruction using STEM tomography in SEMs and DualBeam instruments. A thin section sample of gadolinium nanoparticles ranging in size up to 50 nm mounted on an aluminum substrate was prepared using in-situ lift-out (INLO) by FIB. The sample was thinned using 30 kV Ga~+ FIB to approximately 125 nm. Using an in-situ stage with 360 degree continuous tilt, the thin section was imaged every 1 degree with 30 keV SEM and the STEM detector through approximately 125 degrees of tilt. The data set was then reconstructed into a 3D rendering using FEI's tomography reconstruction software, Inspect3D Express, and visualized using FEI's Avizo image and data analysis software. The technique and results compared with conventional TEM and STEM tomography using a 200 keV FEI Talos TEM will be discussed.
机译:使用FIB进行连续切片以及随后在DualBeam中通过FIB显微镜和扫描电子显微镜(SEM)对同一FIB暴露的表面进行成像,已被证明对于研究复杂工程材料系统的三维(3D)形态特别有用。该技术于2004年作为一种自动过程首次引入,此后已成为FIB和DualBeams的主要应用之一。虽然最先进的系统可以生成z轴切片厚度为3-5 nm的数据集,但FIB纳米断层扫描仍然是一种破坏性技术,并且分辨率受到z轴切片厚度的限制。电子断层扫描是另一种用于可视化透射电子显微镜中以TEM或STEM模式使用的3D结构的技术。使用聚焦在感兴趣区域上的薄样品,电子束穿过样品,围绕样品逐渐围绕感兴趣区域的中心倾斜,因为在相机(TEM)或检测器(STEM)上顺序采集图像。使用多种算法(包括加权反投影(WBP)或串行迭代重建技术(SIRT))将生成的图像重建为3D体积。 SEM中的低能量STEM是SEM和DualBeam FIB-SEM仪器中的常规分析,用于形态表征和超高分辨率成像。使用配置有固态硅二极管STEM检测器和具有足够倾斜自由度的载物台的DualBeam或SEM,可以在SEM和DualBeam仪器中使用STEM断层扫描获取足够数量的图像用于3D重建。使用FIB使用原位提起(INLO)制备大小不超过50 nm的mounted纳米颗粒薄片样品,该样品安装在铝基板上。使用30 kV Ga〜+ FIB将样品稀释至约125 nm。使用具有360度连续倾斜的原位平台,通过30 keV SEM和STEM检测器通过大约125度的倾斜度每1度对薄片进行成像。然后使用FEI的断层扫描重建软件Inspect3D Express将数据集重建为3D渲染,并使用FEI的Avizo图像和数据分析软件进行可视化。将讨论与使用200 keV FEI Talos TEM的常规TEM和STEM层析成像相比的技术和结果。

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