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A simple three-dimensional bond contact model for cemented sands considering the influence of bond width and thickness

机译:考虑粘结宽度和厚度影响的水泥砂简单三维粘结接触模型

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摘要

This study proposes a simple three-dimensional (3-D) bond contact model to describe the behavior of bonding between sand grains. The model, which considers the influences of bond width and thickness, was established by extending the 2-D experimental data to 3-D case, in which bond rolling resistance is neglected for simplicity. This model was then implemented into a Distinct Element Method (DEM) code to simulate triaxial compression tests on the DEM specimens with different cement contents under various confining pressures. The comparison between the DEM and the experimental data shows that the DEM simulations can qualitatively capture the effect of bonding. As cement content increases, strain softening and shear dilation become more pronounced, and both the cohesion and the peak friction angle increase.
机译:这项研究提出了一个简单的三维(3-D)键接触模型来描述砂粒之间键的行为。该模型考虑了粘结宽度和厚度的影响,是通过将2-D实验数据扩展到3-D情况而建立的,为简化起见,忽略了粘结滚动阻力。然后将该模型实现为“离散元方法”(DEM)代码,以模拟在不同围压下具有不同水泥含量的DEM标本上的三轴压缩试验。 DEM和实验数据之间的比较表明,DEM仿真可以定性地捕获键合的效果。随着水泥含量的增加,应变软化和剪切膨胀变得更加明显,内聚力和峰值摩擦角均增加。

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