A high-density 300-Gbit/s parallel optical interconnect module with efficient optical sub-assembly techniques

摘要

A high-density 300-Gbit/s (25-Gbit/s × 12-ch) parallel optical-interconnect module (OIM) was fabricated by using an efficient, newly developed optical sub-assembly (OSA) techniques. The OIM module provides high heat dissipation and high optical-coupling efficiency. Furthermore, the fabricated OIM successfully demonstrated 25-Gbit/s error-free multimode transmission.