首页> 外文会议>IEEE International Conference on Plasma Sciences >Hydrophobic and wear-resistible surface coating of carbon steel using linear microwave plasma with TE-TEM mode power coupling
【24h】

Hydrophobic and wear-resistible surface coating of carbon steel using linear microwave plasma with TE-TEM mode power coupling

机译:用线性微波等离子体具有带TE-TEM模式电源耦合的碳钢疏水和耐磨表面涂层

获取原文

摘要

A linear microwave plasma source has been prepared for hydrophobic and wear-resistible surface coating of carbon steel. Hydrophobic wear-resistible properties are essential for adhesive film cutting tools. Microwave power was coupled to plasma through TE-TEM mode converter. Compared with RF capacitively couple plasmas which have long been used for hydrophobic surface treatment, microwave plasma can provide wider process windows, independent ion energy controllability and faster processing rate. In this study, Ar/CH/CF and their mixture was used for surface treatment. Stable and uniform 45cm-long plasma could be obtained in a pressure range of 100 ~ 500 mTorr with microwave power of 500 W. 13.56 MHz RF power was independently applied to substrate electrode for bias voltage control. After Ar plasma treatment for surface cleaning, Ar/CH and Ar/CH/CF plasma enhanced deposition process has been performed. CH was chosen to achieve wear-resistibility and improve tribological properties by forming a-C:H diamond-like carbon layer. Additional CF incorporation allowed us to enhance hydrophobicity of the surface layer. Optimized deposition condition was investigated as a function of microwave power, gas pressure, gas flow rate and bias power. The nominal deposition rate was 124?/min at Ar:CH = 25:50 sccm, 300 mTorr with microwave power of 300W. After CF plasma incorporation, hydrophobicity was drastically improved. The contact angle was changed from 57 degree to 120 degree.
机译:为碳钢的疏水和耐耐耐耐耐耐耐耐耐耐耐耐磨表面涂层准备了线性微波等离子体源。疏水性耐磨性能对于粘合膜切割工具至关重要。微波功率通过TE-TEM模式转换器耦合到等离子体。与已经长期用于疏水表面处理的RF电容耦合等离子体相比,微波等离子体可以提供更宽的工艺窗口,独立离子能量可控性和更快的处理速率。在该研究中,Ar / Ch / Cf及其混合物用于表面处理。在100〜500 mtorr的压力范围内获得稳定和均匀的45cm长等离子体,微波功率为500W .13.56MHz RF功率独立地施加到基板电极以进行偏置电压控制。在用于表面清洁的AR等离子体处理后,已经进行了AR / CH和AR / CH / CF等离子体增强沉积工艺。选择CH以通过形成A-C:H金刚石碳层来实现耐磨性并改善摩擦学性质。额外的CF掺入允许我们增强表面层的疏水性。研究了优化的沉积条件作为微波功率,气体压力,气体流速和偏置功率的函数。标称沉积速率为124. / min AR:CH = 25:50 SCCM,300 MTORR,微波功率为300W。在CF血浆掺入之后,疏水性大大提高。接触角从57度变为120度。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号