首页> 外文会议> >The influence of annealing on fluorene-type thin film produced by biphenyl and methane RF plasma system
【24h】

The influence of annealing on fluorene-type thin film produced by biphenyl and methane RF plasma system

机译:退火对联苯和甲烷射频等离子体系统产生的芴型薄膜的影响

获取原文

摘要

Fluorene (CH)-type thin films were produced under the capacitively coupled single radio frequency (rf) system by using the biphenyl (CH)/methane (CH) plasma. The circular parallel plate electrodes were used; the upper electrode was connected to 13.56 MHz rf power while the lower electrode was grounded. To control the positive ion bombardment, a negative bias voltage was applied between the holder of the substrate and the wall of the chamber. The properties of the fluorene-type films were explored under the variable plasma parameters of input rf power (150, 200 W), CH flow rate (3, 5 sccm), negative bias voltage (−66 V), and deposition time (20, 30 min) at a constant pressure value of 0.3 mbar. The deposited films were annealed for 1 hour at different temperatures; 200, 300, 400, and 500 C˚. The changes of plasma chemistry during the deposition were investigated by optical emission spectroscopy (OES). The chemical structural properties were examined by fourier transform infrared (FTIR) spectroscopy. After annealing the sp/sp ratio showed a decrease with increasing temperature due to the degassing of CH from the surface and hydrogen release with temperature. The reconfiguration of chemical bonds in the film structure with annealing caused the changes in the intensities of band peaks. Additionally, the annealing increased the amount of sp carbon bonding (carbyne) in the deposited film and led to decrease in the degree of cross-linking. The morphology of the films was analyzed by X-ray diffraction (XRD) and atomic force microscope (AFM). The crystallography of thin film was effectively changed at high rf power and the annealing caused a shifting in diffraction peaks. An increase was observed in crystalline size of the films after the annealing. The surface of thin film indicated significant nanostructures an- peaks at high rf power and CH flow rate. After annealing, the intensity of peaks showed a decrease as a result of the decomposition and compaction of films as well as the reformation of the amorphous covalent network that is occurring smoother surfaces. The thickness was measured by ellipsometer, and since the annealing temperature caused to an effective thermal decay and a disruption of microvoids in the films, the thickness of thin films had a decrease as increased the temperature. The contact angle measurement was used for the determination of hydrophobic behavior of the thin films.
机译:通过使用联苯(CH)/甲烷(CH)等离子体在电容耦合单射频(rf)系统下生产出芴(CH)型薄膜。使用圆形平行板电极。上电极连接到13.56 MHz射频功率,下电极接地。为了控制正离子轰击,在衬底的支座和腔室的壁之间施加负偏压。在输入射频功率(150,200 W),CH流量(3,5 sccm),负偏置电压(-66 V)和沉积时间(20)的可变等离子体参数下探索芴类薄膜的性能,30分钟),压力恒定为0.3毫巴。沉积的薄膜在不同温度下退火1小时; 200、300、400和500C˚。用光发射光谱法(OES)研究了沉积过程中等离子体化学的变化。化学结构性质通过傅立叶变换红外(FTIR)光谱法检查。退火后,sp / sp比随温度升高而降低,这是由于CH从表面脱气以及氢随温度释放而引起的。通过退火使膜结构中的化学键重新配置,从而引起能带峰强度的变化。另外,退火增加了沉积膜中sp碳键(碳炔)的量,并导致交联度降低。通过X射线衍射(XRD)和原子力显微镜(AFM)分析膜的形态。薄膜的晶体学在高射频功率下有效改变,退火导致衍射峰移动。观察到退火后膜的晶体尺寸增加。薄膜的表面在高射频功率和CH流速下显示出明显的纳米结构峰。退火后,由于薄膜的分解和压实以及表面较光滑的无定形共价网络的重整,峰强度有所降低。通过椭圆偏振计测量厚度,并且由于退火温度导致膜中的有效热衰减和微孔的破坏,所以薄膜的厚度随着温度的升高而减小。接触角测量用于确定薄膜的疏水性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号