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27.8 A 4600μm2 1.5°C (3σ) 0.9kS/s thermal-diffusivity temperature sensor with VCO-based readout

机译:27.8 A4600μm 2 1.5°C(3σ)0.9ks / s热扩散温度传感器,基于VCO读数

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Temperature sensors are widely used in microprocessors to monitor on-chip temperature gradients and hot-spots, which are known to negatively impact reliability [1-4]. Such sensors should be: 1) Small to facilitate floor planning; 2) Fast to track millisecond thermal transients and 3) Easy to trim to reduce the associated costs. Recently, it has been shown that thermal diffusivity (TD) sensors can meet these requirements [5]. TD sensors operate by digitizing the temperature-dependent delay associated with the diffusion of heat pulses through an electro-thermal filter (ETF), which, in standard CMOS, can be readily implemented as a resistive heater surrounded by a thermopile. Unlike BJT-based temperature sensors, their accuracy actually improves with CMOS scaling [6], since it is mainly limited by the accuracy of the heater/thermopile spacing, which in turn is determined by lithography. However, the readout circuitry of prior TD sensors has been based on analog phase-domain ΔΣ ADCs, which are not easily ported to low-voltage technologies, and which occupy much more area than the ETF itself [5].
机译:温度传感器广泛用于微处理器,以监测片上温度梯度和热点,该热点是对抗可靠性的负面影响[1-4]。这样的传感器应该是:1)小以方便地板规划; 2)快速跟踪毫秒的热瞬态和3)易于修剪,以降低相关成本。最近,已经表明,热扩散率(TD)传感器可以满足这些要求[5]。 TD传感器通过将与热脉冲扩散的温度依赖性延迟通过电热滤光器(ETF)进行数字化,在标准CMOS中,可以容易地实现为由热电堆包围的电阻加热器。与基于BJT的温度传感器不同,它们的精度实际上可以通过CMOS缩放[6]改善,因为它主要受加热器/热电堆间距的精度限制,这又通过光刻决定。然而,先前TD传感器的读出电路已经基于模拟相位域ΔΣADC,它们不容易移植到低压技术,并且占据比ETF本身更远的区域[5]。

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