首页> 外文会议>IEEE International Solid- State Circuits Conference >3.2 multi-standard 185fsrms 0.3-to-28Gb/s 40dB backplane signal conditioner with adaptive pattern-match 36-Tap DFE and data-rate-adjustment PLL in 28nm CMOS
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3.2 multi-standard 185fsrms 0.3-to-28Gb/s 40dB backplane signal conditioner with adaptive pattern-match 36-Tap DFE and data-rate-adjustment PLL in 28nm CMOS

机译:3.2多标185FS RMS 0.3至28GB / S 40DB背板信号调节器,采用自适应图案 - 匹配36-TAP DFE和数据速率调整PLL在28nm CMOS中

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As processing and network speeds are accelerated to support data-rich services, the bandwidth of backplane interconnects needs to be increased while maintaining the channel length and multi-rate links. However, channel losses and impedance discontinuities increase at high data-rates, making it difficult to compensate the channel. In this work, we target serial links from auto-negotiation in 100G-KR4 of 0.3Gb/s to 32GFC of 28.05Gb/s in 40dB backplane architecture. To achieve this challenge, there are two key techniques. First, we introduce a 36-tap decision-feedback equalizer (DFE) to cancel reflections due to connectors because these reflections close the eye. To operate the 36-tap DFE, we need to fix a CDR lock-point and calculate 36-tap coefficients accurately. Thus, we develop a pattern-captured CDR with a 4b pattern filter to fix the lock-point, and a 3b pattern-matched adaptive equalizer (AEQ) to optimize 36 tap coefficients. These techniques enable our chip to compensate 40dB channel loss. Second, we target 100G-KR4/40G-KR4/10G-KR/25G-KR and 32GFC/16GFC/8GFC/4GFC. To operate across a wide range of data-rates, from 0.3 to 28.05Gb/s, with low jitter, we develop a PLL architecture with two LC-VCOs and one ring VCO with a data-rate-adjustment technique by controlling an LDO. Our test chip is fabricated in 28nm CMOS. Our signal conditioner is the demonstration to achieve the BER <;10 PRBS31 at 100G-KR4 in a 40dB chip-to-chip backplane with two connectors by using the 36-tap DFE to cancel the reflection and to operate across a wide range of data-rates from 0.3 to 28.05Gb/s.
机译:随着加工和网络速度加速到支持数据丰富的服务,需要增加背板互连的带宽,同时保持信道长度和多速率链路。然而,信道损失和阻抗不连续性以高数据速率增加,使得难以补偿通道。在这项工作中,我们在40dB背板架构中以0.3gb / s为0.3g-​​kr4的自动协商串行链接。为实现这一挑战,有两种关键技术。首先,我们介绍一个36分接反馈均衡器(DFE),以取消由于连接器引起的反射,因为这些反射闭眼。要操作36分接DFE,我们需要修复CDR锁定点并准确计算36分接系数。因此,我们开发具有4B图案滤波器的模式捕获的CDR以固定锁定点,以及3B模式匹配的自适应均衡器(AEQ)以优化36个抽头系数。这些技术使我们的芯片能够补偿40dB通道损耗。其次,我们靶向100g-KR4 / 40g-KR4 / 10G-KR / 25G-KR和32GFC / 16GFC / 8GFC / 4GFC。要在多种数据速率范围内操作,从0.3到28.05GB / s,使用低抖动,通过控制LDO,通过两个LC-VCO和一个环VCO开发PLL架构,并通过数据速率调整技术。我们的测试芯片在28nm CMOS中制造。我们的信号调节器是通过使用36分接DFE取消反射并在各种数据中使用两个连接器来实​​现BER <; 10 PRBS31,在40DB芯片到片面背板中实现100G-KR4。 -rates从0.3到28.05gb / s。

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