首页> 外文会议>IEEE International Solid- State Circuits Conference >3.2 multi-standard 185fsrms 0.3-to-28Gb/s 40dB backplane signal conditioner with adaptive pattern-match 36-Tap DFE and data-rate-adjustment PLL in 28nm CMOS
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3.2 multi-standard 185fsrms 0.3-to-28Gb/s 40dB backplane signal conditioner with adaptive pattern-match 36-Tap DFE and data-rate-adjustment PLL in 28nm CMOS

机译:3.2多标准185fs rms 0.3至28Gb / s 40dB背板信号调理器,带有自适应模式匹配36抽头DFE和数据速率调整PLL,位于28nm CMOS中

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As processing and network speeds are accelerated to support data-rich services, the bandwidth of backplane interconnects needs to be increased while maintaining the channel length and multi-rate links. However, channel losses and impedance discontinuities increase at high data-rates, making it difficult to compensate the channel. In this work, we target serial links from auto-negotiation in 100G-KR4 of 0.3Gb/s to 32GFC of 28.05Gb/s in 40dB backplane architecture. To achieve this challenge, there are two key techniques. First, we introduce a 36-tap decision-feedback equalizer (DFE) to cancel reflections due to connectors because these reflections close the eye. To operate the 36-tap DFE, we need to fix a CDR lock-point and calculate 36-tap coefficients accurately. Thus, we develop a pattern-captured CDR with a 4b pattern filter to fix the lock-point, and a 3b pattern-matched adaptive equalizer (AEQ) to optimize 36 tap coefficients. These techniques enable our chip to compensate 40dB channel loss. Second, we target 100G-KR4/40G-KR4/10G-KR/25G-KR and 32GFC/16GFC/8GFC/4GFC. To operate across a wide range of data-rates, from 0.3 to 28.05Gb/s, with low jitter, we develop a PLL architecture with two LC-VCOs and one ring VCO with a data-rate-adjustment technique by controlling an LDO. Our test chip is fabricated in 28nm CMOS. Our signal conditioner is the demonstration to achieve the BER <;10 PRBS31 at 100G-KR4 in a 40dB chip-to-chip backplane with two connectors by using the 36-tap DFE to cancel the reflection and to operate across a wide range of data-rates from 0.3 to 28.05Gb/s.
机译:随着处理速度和网络速度的提高,以支持数据丰富的服务,需要在保持通道长度和多速率链路的同时增加背板互连的带宽。但是,通道损耗和阻抗不连续性在高数据速率下会增加,从而难以补偿通道。在这项工作中,我们的目标是串行链路,从40Gb背板架构中的0.3Gb / s的100G-KR4自动协商到28.05Gb / s的32GFC。为了解决这一挑战,有两种关键技术。首先,我们引入了一个36抽头的决策反馈均衡器(DFE),以消除由于连接器引起的反射,因为这些反射使人眼无法察觉。要操作36抽头DFE,我们需要固定CDR锁定点并准确计算36抽头系数。因此,我们开发了一种模式捕获的CDR,它具有4b模式滤波器来固定锁定点,而3b模式匹配自适应均衡器(AEQ)可以优化36个抽头系数。这些技术使我们的芯片能够补偿40dB的信道损耗。其次,我们定位到100G-KR4 / 40G-KR4 / 10G-KR / 25G-KR和32GFC / 16GFC / 8GFC / 4GFC。为了在0.3至28.05Gb / s的宽范围数据速率下工作且具有低抖动,我们通过控制LDO开发了一种具有两个LC-VCO和一个环形VCO的PLL架构,并采用了数据速率调整技术。我们的测试芯片是在28nm CMOS中制造的。我们的信号调理器是演示,它通过使用36抽头DFE消除反射并在多种数据范围内运行,在带有两个连接器的40dB芯片对芯片背板中实现100G-KR4时的BER <; 10 PRBS31 -速率从0.3到28.05Gb / s。

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