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27.8 A 4600μm2 1.5°C (3σ) 0.9kS/s thermal-diffusivity temperature sensor with VCO-based readout

机译:27.8 A4600μm 2 1.5°C(3σ)0.9kS / s热扩散温度传感器,具有基于VCO的读数

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Temperature sensors are widely used in microprocessors to monitor on-chip temperature gradients and hot-spots, which are known to negatively impact reliability [1-4]. Such sensors should be: 1) Small to facilitate floor planning; 2) Fast to track millisecond thermal transients and 3) Easy to trim to reduce the associated costs. Recently, it has been shown that thermal diffusivity (TD) sensors can meet these requirements [5]. TD sensors operate by digitizing the temperature-dependent delay associated with the diffusion of heat pulses through an electro-thermal filter (ETF), which, in standard CMOS, can be readily implemented as a resistive heater surrounded by a thermopile. Unlike BJT-based temperature sensors, their accuracy actually improves with CMOS scaling [6], since it is mainly limited by the accuracy of the heater/thermopile spacing, which in turn is determined by lithography. However, the readout circuitry of prior TD sensors has been based on analog phase-domain ΔΣ ADCs, which are not easily ported to low-voltage technologies, and which occupy much more area than the ETF itself [5].
机译:温度传感器已广泛用于微处理器中,以监控片上温度梯度和热点,这些现象对可靠性产生负面影响[1-4]。此类传感器应为:1)体积小,以利于平面布置; 2)快速跟踪毫秒热瞬态,以及3)易于调整以降低相关成本。最近,已经显示出热扩散率(TD)传感器可以满足这些要求[5]。 TD传感器通过将与热脉冲通过电热滤波器(ETF)的扩散相关的与温度相关的延迟数字化来进行操作,该电热滤波器在标准CMOS中可以很容易地实现为被热电堆包围的电阻加热器。与基于BJT的温度传感器不同,它们的精度实际上随CMOS比例提高[6],因为它主要受加热器/热电间距的精度限制,而加热器/热电间距的精度又由光刻确定。但是,现有TD传感器的读出电路是基于模拟相域ΔΣADC的,这些ADC不易移植到低压技术中,并且比ETF本身占据更多的面积[5]。

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