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High performance MEMS accelerometer (Gemini accelerometer)

机译:高性能MEMS加速度计(Gemini加速度计)

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UTC Aerospace Systems (UTAS) has developed a family of high performance open loop accelerometers, which, branded under the name "Gemini", aim to meet the needs of aerospace and commercial applications. There are five different acceleration ranges in the family: 0.85g, 2g, 10g, 30g and 96g. The sensor is manufactured and marketed by Silicon Sensing Systems Limited (SSSL). It comprises a silicon MEMS (Micro-Electro-Mechanical System) structure providing two in-plane axes of sensing fabricated using deep reactive ion etching (DRIE). The silicon MEMS is in the form of a lower glass layer, a silicon sensing layer and an upper glass layer. The glass layers are anodically bonded to the silicon layer to form a hermetic assembly. The manufacturing process and equipment used for these accelerometers has been proven over many years by Silicon Sensing Systems Limited in their MEMS gyro production. Differential capacitance sensing, provided by an asymmetric gap between two sets of interdigitated fingers with a fixed set and a moving set, is at the heart of the design. This provides the electrical output. The hermetic sealed structure is backfilled with atmospheric pressure gas giving near critical air squeeze film damping for all variants of the MEMS. This has the linearity characteristic of a differential capacitance and can be modelled to high precision using low order polynomials. The resonant frequency of the MEMS is selected to suit the operational `g' range with three different MEMS designs covering the five `g' ranges. This is packaged with a mixed signal ASIC to provide an analogue output and a digital output via a SPI bus.
机译:UTC航空航天系统(UTAS)开发了一家高性能开环加速度计,该系列以“双子座”名称为宗旨,旨在满足航空航天和商业应用的需求。家庭中有五种不同的加速范围:0.85g,2g,10g,30g和96g。该传感器由硅感测系统限制(SSSL)制造和销售。它包括提供使用深反应离子蚀刻(Drie)制造的两个面内传感轴的硅MEMS(微电机系统)结构。硅MEMS呈下玻璃层,硅感测层和上玻璃层的形式。玻璃层与硅层阳极键合以形成气密组件。通过其MEMS陀螺仪生产的硅感测系统有限,这些加速度计的制造工艺和设备已被证明是多年的。差分电容感测,由具有固定组和移动装置的两组交叉指状物之间的不对称间隙提供,是设计的核心。这提供了电气输出。气密密封结构用大气压气体回填,给出临界空气挤压膜阻尼,用于MEMS的所有变体。这具有差分电容的线性特性,并且可以使用低阶多项式模拟高精度。选择MEMS的谐振频率以适应操作的“G”范围,其中具有覆盖五个“G”范围的三种不同的MEMS设计。这是用混合信号ASIC打包,以通过SPI总线提供模拟输出和数字输出。

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