accelerometers; assembling; capacitance measurement; capacitive transducers; elemental semiconductors; field buses; hermetic seals; integrated circuit bonding; integrated circuit packaging; microfabrication; microsensors; mixed analogue-digital integrated circuits; polynomials; silicon; sputter etching; DRIE; Gemini accelerometer; MEMS accelerometer; MEMS gyroproduction; SPI bus; SSSL; Si; UTAS; UTC Aerospace system; anodical bonding; atmospheric pressure gas; deep reactive ion etching; differential capacitance sensor; glass layer; hermetic assembly; hermetic sealed structure; interdigitated fingers; low order polynomial; microelectromechanical system; microfabrication; mixed signal ASIC; near critical air squeeze film damping; open loop accelerometer; resonant frequency; silicon sensing system limited; Acceleration; Accelerometers; Capacitance; Fingers; Micromechanical devices; Sensors; Silicon;
机译:用于具体SHM应用的高性能MEMS加速度计,并与COTS加速度计进行比较
机译:低成本三轴MEMS加速度计在强震动地震中的适用性:LIS331DLH(iPhone)加速度计的测试
机译:封装对双悬臂高G加速度计MEMS性能的影响
机译:硅振荡加速度计:用于精密导航和战略指导应用的高性能MEMS加速度计
机译:基于电气刺激MEMS加速度计和其他传感器的统计校准模型
机译:MEMS加速度计在线电液驱动器中的位置传感器
机译:使用基于MEMS的压电加速度计连接到并行CMOS电路的数字输出加速度计