首页> 外文会议>China Semiconductor Technology International Conference >A Novel System for Slurry Recycling and Waste Water Permeation
【24h】

A Novel System for Slurry Recycling and Waste Water Permeation

机译:一种新型的浆液回收和废水渗透系统

获取原文

摘要

Traditionally, CMP (chemical mechanical planarization) slurry waste requires significant amount of works including pH neutralization, solid precipitation and toxic separation before discharged into environment. Due to the stringent process control in 1C manufacturing, the slurries typically cannot be reused, and it caused significant burden to the IC fabs ˇfacilities. CMC has successfully developed a novel slurry recycling system which has been implemented in mass production IC fabs over 3 years.. The slurry waste is properly processed to collect both abrasives and permeated water. The abrasive can be further adjusted for continuous polishing usage while the permeated water will be feedback for DI water source. This system has been optimized for reliable slurryˇs physical properties and well verified with stable polishing performance and no impact on polish defectivity.
机译:传统上,CMP(化学机械平面化)浆废料需要大量工作,包括中和pH值,固体沉淀和有毒物质分离,然后再排放到环境中。由于1C制造过程中严格的过程控制,因此浆液通常无法重复使用,这给IC晶圆厂的设施造成了沉重负担。 CMC已成功开发了一种新颖的浆料回收系统,该系统已在大规模生产的IC晶圆厂中实施了3年多。正确处理浆料废料以收集磨料和渗透水。可以进一步调整研磨剂以进行连续抛光,同​​时将渗透水反馈给去离子水源。该系统已经过优化,具有可靠的浆料物理性能,并经过验证,具有稳定的抛光性能,并且对抛光缺陷率没有影响。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号