首页> 外文会议>SMTA international conference >MEASUREMENT OF THE HIGH STRAIN RATE MECHANICAL BEHAVIOR OF SAC305 ALLOY AT PRODUCT OPERATING TEMPERATURE AND DERIVATION OF ANAND VISCOPLASTICITY CONSTANTS
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MEASUREMENT OF THE HIGH STRAIN RATE MECHANICAL BEHAVIOR OF SAC305 ALLOY AT PRODUCT OPERATING TEMPERATURE AND DERIVATION OF ANAND VISCOPLASTICITY CONSTANTS

机译:SAC305合金在产品工作温度下高应变速率力学行为的测量以及非粘塑性常数的衍生

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Predictive life models for assessment of the electronics survivability need the high strain rate mechanical properties to capture the interconnect deformation during transient-shock. Electronics products are often at a high or low operating temperature when subjected to shock-impact during accidental drop. Leadfree solders have been used as interconnects in electronic packaging, due to its environmental friendly chemical property. Interconnects during shock may be subjected to strain rates in the neighborhood of 1-100 sec~(-1). However, the high strain rate mechanical properties of SAC leadfree alloys at operating temperatures are scarce. Anand viscoplasticity is often used to model the constitutive behavior of the leadfree solders under thermo-mechanical deformation at strain rates in the neighborhood of 10~(-5) to 10~(-3) per sec. However, Anand viscoplasticity constants are not available for the high strain rates encountered by electronic interconnects under shock and vibration. In this paper, the nine material parameters to fit the Anand viscoplastic model at high strain rates have been presented. In order to develop the constants for this model, uniaxial tensile tests at several strain rates and temperatures have been completed. A constant strain rate impact hammer which enables attaining strain rates around 1 to 100 per sec has been employed to implement tensile tests and a small thermal chamber is applied to control testing temperature. High speed cameras operating at 70,000 fps have been used to capture images of specimen and then digital image correlation method is used to calculate tensile strain. Uniaxial stress-strain curves have been plotted over a wide range of strain rates (ε=10, 35, 50, 75 /sec) and temperatures (T = 25, 50, 75, 100, 125°C). Anand viscoplasticity constants have been calculated by non-linear fitting procedures. In addition, the accuracy of the extracted Anand constants has been evaluated by comparing the model prediction and experimental data.
机译:用于评估电子设备生存能力的预测寿命模型需要高应变速率机械性能,才能捕获瞬态电击期间的互连变形。电子产品在意外跌落时受到冲击时,通常处于较高或较低的工作温度下。由于无铅焊料的环保化学特性,它已被用作电子包装中的互连件。冲击过程中的互连可能会承受1-100 sec〜(-1)附近的应变率。但是,SAC无铅合金在工作温度下的高应变速率机械性能是稀缺的。 Anand粘塑性常用于模拟无铅焊料在热机械变形下的应变速率为每秒10〜(-5)至10〜(-3)的本构行为。但是,Anand粘塑性常数不适用于电子互连件在冲击和振动下遇到的高应变率。在本文中,已经提出了九种材料参数,以适应高应变速率下的Anand粘塑性模型。为了建立该模型的常数,已经完成了在几种应变速率和温度下的单轴拉伸试验。使用恒定应变率的冲击锤来实现大约每秒1至100的应变率,以进行拉伸测试,并使用一个小的热室来控制测试温度。已使用以70,000 fps的速度运行的高速相机捕获标本的图像,然后使用数字图像相关方法来计算拉伸应变。单轴应力-应变曲线已在很宽的应变速率(ε= 10、35、50、75 / sec)和温度(T = 25、50、75、100、125°C)范围内绘制。 Anand粘塑性常数已通过非线性拟合程序计算。此外,已通过比较模型预测值和实验数据来评估提取的Anand常数的准确性。

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