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SHAPE MEMORY POLYMERS - VISCOELASTIC THERMOMECHANICAL CONSTITUTIVE MODELING

机译:形状记忆聚合物-粘弹性热力学本构模型

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Shape memory polymers (SMPs) are known to change their elastic stiffness as they respond to change in induced stimulus such as temperature. Under appropriate loading and pre-deformation, a shape memory effect can be captured as the stimulus change. From the nature of polymers, the pre-deformation can tend to be large and can in turn be memorized by SMPs. Due to this characteristic of SMPs, it makes a great candidate for morphing structures. To analyze complex structures a simple but yet practical constitutive model needs to be developed for commercial engineering application. In this paper, a thermomechanical constitutive model is proposed making use of the standard linear viscoelastic model. The total strain during the shape memorization process is defined by mechanical, thermal and storage strains. The rheological model defined is an elastic element in parallel with a Maxwell element, which in turn are both in series with storage and thermal element. Inclusion of a storage strain within the model reveals the internal strain storage mechanism as the temperature of the material drops. Similar work done in the past requires material parameters that can be arduous to determine in the laboratory. This model proposes a simplified approximate material parameter called a binding factor which accounts for the polymer's molecular architecture and morphology as the temperature changes. Finally, the model is applied to a four step shape memorization and stress-free recovery process. For this study, the four steps considered are a) Pre-loading of the material at high temperature b) Constant strain fixity c) unconstrained relaxation at low temperature d) unconstrained free strain recovery. The developed model is validated by comparing the predictions to experimental results in literature.
机译:众所周知,形状记忆聚合物(SMP)会改变其弹性刚度,因为它们会响应感应刺激(例如温度)的变化。在适当的载荷和预变形下,形状记忆效应可以随着刺激变化而捕获。从聚合物的性质来看,预变形可能会很大,并且可能会被SMP记忆。由于SMP的这一特性,它非常适合用于变形结构。为了分析复杂的结构,需要开发一种简单但实用的本构模型以用于商业工程应用。本文提出了一种利用标准线性粘弹性模型的热机械本构模型。形状记忆过程中的总应变由机械,热和存储应变定义。定义的流变模型是与麦克斯韦元件并联的弹性元件,麦克斯韦元件又与存储元件和热元件串联。在模型中包含一个存储应变可以显示出随着材料温度的下降而产生的内部应变存储机制。过去完成的类似工作需要在实验室中难以确定的材料参数。该模型提出了一种简化的近似材料参数,称为结合因子,该参数说明了温度变化时聚合物的分子结构和形态。最后,将该模型应用于四步形状记忆和无应力恢复过程。对于本研究,考虑的四个步骤是:a)高温下的材料预加载b)恒定的应变固定性c)低温下不受约束的松弛d)不受约束的自由应变恢复。通过将预测结果与文献中的实验结果进行比较来验证所开发的模型。

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