首页> 外文会议>ASME conference on smart materials, adaptive structures and intelligent systems >DAMAGE SENSITIVITY AND MULTIPLE DAMAGE DETECTION IN GLASS FIBER/EPOXY LAMINATES WITH CARBON BLACK FILLER VIA ELECTRICAL IMPEDANCE TOMOGRAPHY
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DAMAGE SENSITIVITY AND MULTIPLE DAMAGE DETECTION IN GLASS FIBER/EPOXY LAMINATES WITH CARBON BLACK FILLER VIA ELECTRICAL IMPEDANCE TOMOGRAPHY

机译:碳黑填料对玻璃纤维/环氧树脂层压板的损伤敏感性和多次损伤检测的电阻抗层析成像

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Utilizing conductivity changes to locate matrix damage in glass fiber reinforced polymers (GFRPs) manufactured with nanocomposite matrices is a promising avenue of composite structural health monitoring (SHM) with the potential to ensure unprecedented levels of safety. Nanocomposites depend on the formation of well-connected nanofiller networks for electrical conductivity. Therefore, matrix damage that severs the connection between nanofillers will manifest as a local change in conductivity. This research advances state of the art conductivity-based SHM by employing electrical impedance tomography (EIT) to locate damage-induced conductivity changes in a glass fiber/epoxy laminate manufactured with carbon black (CB) filler. EIT for damage detection is characterized by identifying the lower threshold of through-hole detection and demonstrating the capability of EIT to accurately resolve multiple through holes. It is found that through holes as small as 3.18 mm in diameter can be detected, and EIT can detect multiple through holes. However, sensitivity to new through holes is diminished in the presence of existing through holes unless a damaged baseline is used. These research findings demonstrate the considerable potential of conductivity-based health monitoring for GFRP laminates with conductive networks of nanoparticles in the matrix.
机译:利用电导率变化来定位由纳米复合材料基质制造的玻璃纤维增​​强聚合物(GFRP)中的基质损伤是复合结构健康监测(SHM)的有希望的途径,具有确保前所未有的安全水平的潜力。纳米复合材料取决于良好连接的纳米填料网络的导电性。因此,切断纳米填料之间连接的基质损伤将表现为电导率的局部变化。这项研究通过使用电阻抗层析成像(EIT)来定位由炭黑(CB)填料制成的玻璃纤维/环氧树脂层压板中由损伤引起的电导率变化,从而推动了基于电导率的SHM的发展。用于损伤检测的EIT的特征是识别通孔检测的下限阈值,并证明EIT能够准确解析多个通孔。发现可以检测到直径仅为3.18毫米的通孔,而EIT可以检测到多个通孔。但是,除非存在损坏的基线,否则在存在现有通孔的情况下,对新通孔的敏感性会降低。这些研究结果表明,对于具有基质中纳米颗粒导电网络的GFRP层压板,基于导电率的健康监测具有巨大潜力。

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