Jet impingement cooling with phase change has shown the potential to meet the increased cooling capacity demands of high-power-density (of order 100 W/cm~2) automotive electronics components. In addition to improved heat transfer, phase change cooling has the potential benefit of providing a relatively isothermal cooling surface. In the present study, two-phase jet impingement cooling of multiple electronic devices is investigated, where the fluorinated dielectric fluid HFE-7100 is used as the working fluid. Four different types of jet arrays, namely, a single round jet with orifice diameter of 3.75 mm, and three different 5×5 arrays of found jets with orifice diameters of 0.5 mm, 0.6 mm and 0.75 mm, were tested and compared for both heat transfer and pressure drop. The experimental Reynolds number at the orifice ranged from 1860 to 9300. The results show that for the same orifice pressure drop, the single jet reached CHF at approximately 60 W/cm~2, while the 5 × 5 array (d = 0.75 mm) safely reached heat fluxes exceeding 65 W/cm~2 without reaching CHF. Additionally, the experimental results show that the multi-device cooler design causes an unintended rise in pressure inside the test section and a subsequent increase in sub-cooling from 10 K to 23.3 K.
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机译：具有相变的射流冲击冷却已显示出满足高功率密度（约100 W / cm〜2量级）汽车电子组件不断增长的冷却能力要求的潜力。除了改进的热传递，相变冷却还具有提供相对等温的冷却表面的潜在好处。在本研究中，研究了多个电子设备的两相射流冲击冷却，其中氟化介电流体HFE-7100被用作工作流体。测试并比较了四种不同类型的喷嘴阵列，即孔口直径为3.75毫米的单个圆形喷嘴和三种不同的5×5阵列，分别发现孔口直径为0.5毫米，0.6毫米和0.75毫米的喷嘴，并比较了两种加热方式转移和压降。孔口的雷诺数实验值为1860至9300。结果表明，在相同的孔口压降下，单股射流的CHF约为60 W / cm〜2，而5×5阵列（d = 0.75 mm）安全地达到超过65 W / cm〜2的热通量而不达到CHF。此外，实验结果表明，多设备冷却器设计会导致测试区域内的压力意外升高，并随后使过冷度从10 K增加到23.3K。
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