Modeling electromagnetic radiation at high-density PCB/connector interfaces

摘要

Electromagnetic radiation for a commercial printed circuit board (PCB) connector is investigated in this paper. The simulation models of the connector are shown to be validated by comparing measured and simulated S-parameters. Analytical formulas are provided to calculate the total loss and the radiated power from a PCB/connector structure when material losses are known. The total power loss for the considered geometry is shown to be dominated by material loss rather than radiated power loss. Termination schemes and additional geometry details in the connector model are also studied for their effects on the radiated power.