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The new ST Super-junction Technologies ideal for Resonant Topologies

机译:新的ST超结技术非常适合谐振拓扑

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摘要

Power supply designers are now the necessity to increase the power density and have an efficient thermal management. An answer to this is in the resonant topologies that more often use the LLC resonant converter. For these topologies, the MOSFET parasitic capacitances can affect the total behaviors increasing switching losses and decreasing efficiency. Aim of this article is to compare the electrical performances of the two most recent ST MOSFET Superjunction technologies, MDmesh II PlusTM low Qg and MDmesh V technology respectively and compare them to the well-known Super-junction competition devices.
机译:现在,电源设计人员必须增加功率密度并进行有效的热管理。对此的答案是在更常使用LLC谐振转换器的谐振拓扑中。对于这些拓扑,MOSFET寄生电容会影响总体性能,从而增加开关损耗并降低效率。本文旨在比较两种最新的ST MOSFET超级结技术MDdesh II PlusTM低Qg和MDmesh V技术的电性能,并将其与著名的超级结竞争器件进行比较。

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