the rapid technological advancements and market demands in electronic sector requires application of highly accelerated, still practice relevant reliability assessment methods. At present, accelerated power and temperature cycling tests count as the state of the art for qualification of the devices. However due to physical characteristics of the devices, there are limitations to accelerated thermal and power cycling tests. Further acceleration by exceeding a critical temperature or time reduction may result in occurrence of failure mechanisms other than those encountered in real application or suppressing these failures. An alternative approach for further acceleration of the testing procedures is based on the application of isothermal mechanical fatigue testing at high frequencies (AMT). The principle idea of this approach is replacement of thermally induced strains by means of equivalent mechanical strains. Based on a physics of failure approach, the relevant failure modes in the material interfaces are induced enabling detection of weak sites of the devices in a very short duration of time. In addition of time saving factor a further advantage of mechanical fatigue testing is the possibility of decoupling of thermal, mechanical and environmental stress factors for a more effective investigation and diagnosis. This paper presents an overview of our recent reliability studies on different types of electronic components by using the proposed methodology with the aim to give an insights into the advantages and some restrictions of AMT for qualification of electronic devices.
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