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A Low-Voltage 5.8-GHz Complementary Metal Oxide Semiconductor Transceiver Front-End Chip Design for Dedicated Short-Range Communication Application

机译:专用于短距离通信应用的低压5.8 GHz互补金属氧化物半导体收发器前端芯片设计

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A 5.8-GHz transceiver front-end applied in dedicated short-range communication (DSRC) systems which is developed in public traffic transportation to improve the safety is fabricated on a chip using TSMC 0.18-μm CMOS process. The proposed prototype includes an asymmetric T/R switch, a current-reused LNA, and a class A power amplifier (PA) on the low-voltage operation in order to minimize the power consumption. Measured results achieve the power gain of 11 dB, the NF of 4.9 dB, the third-order intercept point (IIP3) of -5.4 dBm, and the power consumption of 3.9 mW in the receiving (Rx) mode. On the other hand, the power gain of 12.4 dB, the output 1 dB compression point (OP_(-1dB)) of 11.4 dBm, the PAE of 14.7 % at P_(-1dB), the IMD3 of -15.8 dBc at 1 dB compression level, the output power of 2.6 dBm with a 50 Ω load, and power consumption of 116.3 mW are obtained in the transmitting (Tx) mode. The overall chip area is 1.5 (1.32 × 1.14) mm~2. This RF CMOS transceiver front-end includes all matching circuits and biasing circuits, and no external components are required.
机译:使用TSMC0.18-μmCMOS工艺在芯片上制造了一个5.8 GHz收发器前端,该前端在公共交通运输中开发用于提高安全性的专用短程通信(DSRC)系统中。拟议的原型包括一个不对称的T / R开关,一个可重用电流的LNA和一个用于低压操作的A类功率放大器(PA),以最大程度地降低功耗。测量结果实现了11 dB的功率增益,4.9 dB的NF,-5.4 dBm的三阶交调点(IIP3)和接收(Rx)模式下的3.9 mW功耗。另一方面,功率增益为12.4 dB,输出1 dB压缩点(OP _(-1dB))为11.4 dBm,PAE在P _(-1dB)下为14.7%,IMD3在-15.8 dBc下在发射(Tx)模式下,压缩等级,负载为50Ω时的输出功率为2.6 dBm,功耗为116.3 mW。芯片总面积为1.5(1.32×1.14)mm〜2。此RF CMOS收发器前端包括所有匹配电路和偏置电路,不需要任何外部组件。

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