chip scale packaging; mainframes; microprocessor chips; parallel machines; radiation hardening (electronics); 20 PetaFLOP; 96 rack system; BG/Q compute processor chip; IBM BlueGene; IBM Q processor; MTBF; New York City; accelerated irradiation; accelerated proton irradiation; autonomous hardware detection; autonomous hardware recovery; chip packaging materials; fault injection; mean-time-between-failures; microprocessors soft error resiliency characterization; supercomputers; Circuit faults; Hardware; Neutrons; Packaging; Particle beams; Radiation effects; System-on-chip;
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机译:软件过程改进之旅:IBm澳大利亚应用程序管理服务