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Design consideration for contactless DC connector in high power density future 380 V DC distribution system

机译:高功率密度未来380 V直流配电系统中非接触式DC连接器的设计注意事项

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Design consideration for the contactless DC connector has been conducted for future high power density 380 V DC distribution system. The power density barrier of 1.2 kW 384 V-192 V inductively-coupled connector based on the LLC resonant converter topology using GaN transistors has been evaluated taking the influences of the circuit configurations, parameters related to the transformer and the semiconductor power devices into account. The LLC topology with full-bridge rectifier using GaN transistors and Si-SBDs have the potential to realize higher power density connector compared with the configurations using center-tapped transformer and the half-bridge rectifier with SiC-SBDs. A prototype of a 1.2 kW 384 V-192 V contactless connector using GaN-HEMTs and Si-SBDs has been fabricated, and the efficiency of over 96.0 % and the ideal power density of 5.0 W/cm have been confirmed experimentally under 500 kHz operation. Design consideration has also shown the potential to achieve higher power density of 10 W/cm. The proposed connector contributes to realizing high power density DC distribution system, because functions for both the isolated DC-DC converter and the conventional connector are integrated in a single instrument.
机译:对于未来的高功率密度380 V DC配电系统,已经进行了非接触式DC连接器的设计考虑。基于电路配置,与变压器和半导体功率器件有关的参数的影响,对基于GaN晶体管的LLC谐振转换器拓扑结构的1.2 kW 384 V-192 V电感耦合连接器的功率密度壁垒进行了评估。与使用中心抽头变压器和带有SiC-SBD的半桥整流器的配置相比,具有使用GaN晶体管和Si-SBD的全桥整流器的LLC拓扑具有实现更高功率密度连接器的潜力。已制造出使用GaN-HEMT和Si-SBD的1.2 kW 384 V-192 V非接触式连接器的原型,并已在500 kHz操作下通过实验确定了超过96.0%的效率和5.0 W / cm的理想功率密度。设计方面的考虑还显示出实现10 W / cm更高功率密度的潜力。提出的连接器有助于实现高功率密度DC分配系统,因为隔离式DC-DC转换器和常规连接器的功能都集成在单个仪器中。

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