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A comprehensive comparison of superior triple-threshold-voltage 7-transistor, 8-transistor, and 9-transistor SRAM cells

机译:全面的高级三阈值电压7晶体管,8晶体管和9晶体管SRAM单元比较

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Conventional Static Random Access Memory (SRAM) cells suffer from an intrinsic data instability problem due to directly-accessed data storage nodes during a read operation. Noise margins of memory cells further shrink with increasing variability and decreasing power supply voltage in scaled CMOS technologies. Triple-threshold-voltage seven-transistor (7T), eight-transistor (8T), and nine-transistor (9T) SRAM cells are characterized for layout area, data stability, write voltage margin, idle mode leakage currents, data access speed, and active power consumption considering process parameter fluctuations in a TSMC 65nm CMOS technology in this paper. The single-ended and differential read / write schemes are also compared for data access speed and power consumption in SRAM circuits.
机译:由于在读取操作期间直接访问数据存储节点,传统的静态随机存取存储器(SRAM)单元遭受固有的数据不稳定性问题。在按比例缩放的CMOS技术中,随着可变性的增加和电源电压的降低,存储单元的噪声容限进一步缩小。三阈值电压七晶体管(7T),八晶体管(8T)和九晶体管(9T)SRAM单元具有以下特点:布局面积,数据稳定性,写入电压裕量,空闲模式泄漏电流,数据访问速度,本文考虑了台积电65nm CMOS技术中工艺参数的波动,以及有功功耗。还比较了单端和差分读/写方案在SRAM电路中的数据访问速度和功耗。

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