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Revisiting FPGA Routing under Varying Operating Conditions

机译:在不同的操作条件下重新审视FPGA路由

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FPGA devices are continually integrating more and more resources to satisfy emerging applications' performance requirements, which has increased the power of cutting-edge devices beyond CPUs. Consequently, more aggressive power reduction techniques have been explored recently, including voltage scaling, which is also adopted by several commercial FPGA families. In this paper, we investigate the FPGA routing (both the interconnection network and the routing algorithm) under variable voltage, temperature, as well as degradation. We first examine routing switch boxes (SBs) and point out that SBs with different wire segment lengths have different sensitivity/tolerance to varying operating conditions. Accordingly, we show how architectures with similar overall efficiency in the nominal condition can have a different performance at the scaled voltage or temperature. Finally, we reveal that unlike current FPGA flow that first accomplishes the placement and routing and ex-posts multi-condition timing analysis, bringing the timing information of the actual operating condition in the placement and routing steps helps the underlying algorithms to utilize the resources that have better relative efficiency in the target condition, leading to higher performance.
机译:FPGA设备不断集成越来越多的资源来满足新兴应用程序的性能要求,这增加了尖端设备超越CPU之外的尖端设备的功率。因此,最近已经探讨了更具侵略性的功率降低技术,包括电压缩放,这也被几个商业FPGA系列采用。在本文中,我们在可变电压,温度和劣化下调查FPGA路由(互连网络和路由算法)。我们首先检查路由开关盒(SBS)并指出具有不同线段长度的SBS具有不同的灵敏度/容差与不同的操作条件。因此,我们展示了在标称情况下具有相似的整体效率的架构在缩放电压或温度下具有不同的性能。最后,我们揭示了与当前FPGA流不同,首先完成放置和路由和ex-Post的多条件定时分析,使得放置和路由步骤中实际操作条件的定时信息有助于底层算法利用资源在目标条件下具有更好的相对效率,从而提高性能。

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