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0.35#x03BC;m SPDT RF CMOS switch for wireless communication application

机译:用于无线通信应用的0.35μmSPDT RF CMOS开关

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In recent years, wireless communication particularly in the front-end transceiver architecture has increased its functionality. This trend is continuously expanding and of particular is reconfigurable radio frequency (RF) front-end. A multi-band single chip architecture which consists of an array of switches and filters could simplify the complexity of the current superheterodyne architecture. In this paper, the design of a Single Pole Double Throw (SPDT) switch using 0.35μm Complementary Metal Oxide Semiconductor (CMOS) technology is discussed. The SPDT RF CMOS switch was then simulated in the range of frequency of 0–2GHz. At 2 GHz, the switch exhibits insertion loss of 1.153dB, isolation of 21.24dB, P1dB of 21.73dBm and IIP3 of 26.02dBm. Critical RF T/R switch characteristic such as insertion loss, isolation, power 1dB compression point and third order intercept point, IIP3 is discussed and compared with other type of switch designs. Pre and post layout simulation of the SPDT RF CMOS switch are also discussed to analyze the effect of parasitic capacitance between components' interconnection.
机译:近年来,特别是在前端收发器体系结构中的无线通信增加了其功能。这种趋势正在不断扩大,特别是可重新配置的射频(RF)前端。由开关和滤波器阵列组成的多频带单芯片架构可以简化当前超外差架构的复杂性。本文讨论了采用0.35μm互补金属氧化物半导体(CMOS)技术的单刀双掷(SPDT)开关的设计。然后在0–2GHz的频率范围内对SPDT RF CMOS开关进行了仿真。在2 GHz时,该开关的插入损耗为1.153dB,隔离度为21.24dB,P1dB为21.73dBm,IIP3为26.02dBm。讨论了关键的射频T / R开关特性,例如插入损耗,隔离度,功率1dB压缩点和三阶截取点IIP3,并将其与其他类型的开关设计进行了比较。还讨论了SPDT RF CMOS开关的布局前和布局后仿真,以分析组件互连之间的寄生电容的影响。

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