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A thirty two element phased-array transceiver at 60GHz with RF-IF conversion block in 90nm flip chip CMOS process

机译:具有60GHz的三十两个元素相控阵收发器,RF-IF转换块在90nm倒装芯片CMOS过程中

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A 60 GHz 32 element bidirectional phased-array TX/RX chip with a 2 bit phase shifter and IF converter to/from 12GHz, using 90nm CMOS process, is described. The array features 12.5 dB gain, noise figure (NF) of 11 dB, IP1dB of -17dbm for RX, and total output Psat of +8dBm for TX, drawing 390 mA from a 1.3-V supply. The RMS amplitude and phase error of the phase shifter is 0.8dB and 5° max respectively from 57 to 66 GHz. The paper emphasizes the flip-chip assembly technology selected and its impact on performance, and the phase and amplitude errors resulted by physical impairments such as the finite isolation between different chains. Special test structures were designed to measure bump isolation and insertion loss (IL). The designed architecture together with the compact layout results in a die area of 14.5mm2 for the full array. To our knowledge, this is the first report on a large bidirectional 60 GHz array, with the lowest reported chip power consumption and size.
机译:描述了60 GHz 32元件双向相控阵TX / RX芯片,其中具有2位移相器和使用90nm CMOS工艺的2位移相器和12GHz的转换器,如果转换器,则使用90nm CMOS工艺。 阵列具有11 dB的11 dB的增益,噪声系数(NF)为-17dBm,RX,TX的总输出PSAT为+ 8dBm,从1.3V电源绘制390 mA。 相移器的RMS幅度和相位误差为0.8dB和5° 最大值分别为57到66 GHz。 本文强调选择倒装芯片组装技术及其对性能的影响,以及相位和幅度误差,由物理损伤导致,例如不同链之间的有限隔离。 设计特殊的测试结构以测量凸块隔离和插入损耗(IL)。 设计的架构与紧凑的布局一起导致为完整阵列的芯片区域为14.5mm 2 。 据我们所知,这是一个关于大型双向60 GHz阵列的第一个报告,报告的芯片功耗和尺寸最低。

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