This paper describes the design, fabrication, characterization and packaging of a 256 element MEMS floating element shear stress sensor array-on-a-chip. This device is targeted at measuring time resolved fine spatial scale shear stress beneath the turbulent boundary layer (TBL) for aerospace applications. The differential measurement shows a sensitivity of 0.08 mV/Pa at 0.27 mV/(Hz)~(1/2). The linear ranges are observed up to 3.6 Pa and 6 Pa respectively for 3μm and 10 μm-thick structure.
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