Analysis of EM Emission Characteristics by Arbitrarily Oriented Microstrip Lines Based on TEM Cell Electric and Magnetic Coupling Fields

摘要

In this paper, we analyzed electromagnetic (EM) emission characteristics with arbitrarily oriented microstrip lines on a printed circuit board (PCB). The designed DUTs are based on line patterns between an integrated circuit (IC) and electronic parts on a PCB. These represent EM models of interconnect line, signal propagation, and IC itself. The method of lines (MoL) is used to calculate the coupling capacitance matrix between the microstrip lines and the transverse electromagnetic (TEM) cell. This matrix is also used to calculate self-inductance and coupling inductance. In order to apply this method to real system modules, a model library for coupling factors was built with variations of length and direction of microstrip lines. The comparison results between measurement and modeling shows good agreement below 200 MHz.