Application of Two Mixed Potential Integral Equations to Electromagnetic-circuit Simulation of Three-dimensional Interconnects in Layered Media

摘要

Electromagnetic-circuit simulation of three-dimensional (3-D) arbitrary-shaped conducting objects over conducting substrate layers is addressed. The electromagnetic-circuit surface integral equations are presented for two mixed potential integral equation (MPIE) forms of electric field integral equation (EFIE) based on the Michalski-Mosig formulation where different sets of layered kernels are involved. Various new ways of applying external voltage and current sources are discussed in detail. Numerical results are presented for validation of the proposed methods.