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Surface roughness plays a key role on power factor of sub-50 nm thermoelectric devices

机译:表面粗糙度在50 nm以下热电器件的功率因数中起关键作用

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The effect of surface roughness becomes dominant in sub-50 nm scale ultra thin devices and play a crucial role in determining their transport properties. In this study, we theoretically investigate the influence of surface roughness effects on the thermopower of the device subjected to a temperature gradient by using non equilibrium green function formalism. For systematic investigations the variations in thickness due to surface roughness have been modeled with a square wave profile characterized with three parameters: amplitude A0, crest width λb and trough width λw. The investigations show that fluctuations in the thickness due to surface roughness result in alternate regions of low and high quantum confinement which cause the electrons to flow in higher energy levels. Thus higher voltages are required to nullify the current flowing due to temperature gradient resulting in Seebeck coefficient to increase. It is observed that conductance of the channel due to surface roughness effects decreases more than the increase in Seebeck coefficient and hence the power factor determined by the product of conductance and Seebeck coefficienent decreases.
机译:表面粗糙度的影响在低于50 nm的超薄器件中占主导地位,并在确定其传输特性中起关键作用。在这项研究中,我们通过使用非平衡格林函数形式,从理论上研究了表面粗糙度效应对温度梯度条件下器件热功率的影响。为了进行系统研究,使用方波轮廓对由于表面粗糙度导致的厚度变化进行了建模,该方波轮廓具有三个参数:振幅A 0 ,波峰宽度λ b 和波谷宽度λ w 。研究表明,由于表面粗糙度导致的厚度波动会导致低和高量子限制的交替区域,从而导致电子以较高的能级流动。因此,需要更高的电压来消除由于温度梯度而导致的电流流动,从而导致塞贝克系数增加。可以观察到,由于表面粗糙度的影响,通道的电导率下降的幅度大于塞贝克系数的增加,因此,由电导率和塞贝克系数乘积确定的功率因数降低。

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