This contribution, carried out in the frame of the European JTI ‘Clean Sky', is presenting theresults of a research program investigating the curing of paste adhesives by induction heating.The goal is to modify the paste adhesive to be able to heat it by induction, having the possibilityto bond non-electrical conductive composites structures e.g. Glass fiber reinforced polymers(GFRP). Additionally, the possibility to accelerate the curing process of adhesives used to bondconductive composites, e.g. carbon fiber reinforced polymers (CFRP), and its effects on themechanical performance are investigated. Different fillers, made of electrical conductive andferromagnetic materials, are mixed with the paste adhesive and then cured by induction. Then,the temperature generated in the modified paste adhesive is measured. Samples of compositebonded systems are mechanically tested to observe the effects of the particles on the mechanicalperformance of the joint and assess to the potential of bonding of CFRP and GFRP structures byinduction heating.
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