首页> 外文会议>ASME international mechanical engineering congress and exposition;IMECE2011 >LOWVOLTAGE ELECTROHYDRODYNAMIC MICROPUMP FOR COOLING OF ELECTRONIC DEVICE
【24h】

LOWVOLTAGE ELECTROHYDRODYNAMIC MICROPUMP FOR COOLING OF ELECTRONIC DEVICE

机译:用于电子设备冷却的低压电热微泵

获取原文

摘要

To dissipate the high heat generated in microprocessors and electronic components, electrohydrodynamic (EHD) micropumps are often used. An EHD system involves the interaction of a flow field and an applied electric field; specifically, an ion- drag EHD micropump uses the interaction of an electric field with electric charges, dipoles or particles embedded in a dielectric fluid in order to generate a net flow. These EHD micropumps, require high voltage to drive the fluid, and as a result have not gained wide application. This study presents a systematic analytical method of reducing the high voltage requirement. The approach is to select a dielectric material such that flow rate is maximized with low electric potential. It is known that the dielectric maximum velocity is a function of the dielectric potential, dielectric permittivity, and viscosity. In this paper, a flow rate is assumed to be sufficient. The electric potential is decreased by selecting the appropriate fluid. Fluid of high permittivity and low viscosity will enhance the potential factor there by, decreasing the potential.
机译:为了消除微处理器和电子元件中产生的高热量,经常使用电动流体动力学(EHD)微型泵。 EHD系统涉及流场和外加电场的相互作用。具体而言,离子阻力EHD微型泵利用电场与嵌入介电流体中的电荷,偶极子或粒子的相互作用来产生净流量。这些EHD微型泵需要高压来驱动流体,因此并未得到广泛的应用。这项研究提出了一种降低高压要求的系统分析方法。该方法是选择介电材料,以使流速在低电势下最大化。已知介电最大速度是介电势,介电常数和粘度的函数。在本文中,假定流量足够。通过选择适当的流体可以降低电势。高介电常数和低粘度的流体将通过减小电势来增强那里的电势因数。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号