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Dynamic Pulsing of a MOPA Fiber Laser

机译:MOPA光纤激光器的动态脉冲

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Dynamic Pulsing is demonstrated using a pulsed MOPA fiber laser at 1064nm. The output of the MOPA laser is a pulsed profile consisting of a burst of closely spaced pulses. Tests were performed under several materials with pulse bursts ranging from 10ns to 1μs and operating from 500kHz down to single shot. In particular, percussion drilling in stainless steel is demonstrated showing improvements in quality and speed of the process. These profiles allow high flexibility and optimization of the process addressing the specificity of the end application. Dynamic Pulsing allows the same MOPA fiber laser to be used in diverse materials as well as different processes such us marking, drilling, scribing and engraving. The pulsed fiber laser used in this study is a MOPA-DY by Multiwave Photonics. It is based on a modulated seed laser followed by a series of fiber amplifiers and ending with an optically isolated collimator. This pulsed laser model has an output in such a way that each trigger produces a fast burst of pulses, with a repetition frequency within the burst of the order of tens of MHz. Within the burst it is possible to change the number of pulses, the individual pulse profile, burst pulse period and even to generate non-periodic burst pulse separations. The laser allows full freedom for all these combinations. The study here reported compares the impact of pulse peak power, number of pulses within a burst and the pulse burst period, on process quality (heat affected zone, debris, hole uniformity) and drilling yield.
机译:使用脉冲MOPA光纤激光器在1064nm处演示了动态脉冲。 MOPA激光器的输出是一个脉冲轮廓,由一系列紧密间隔的脉冲组成。测试是在几种材料下进行的,脉冲范围为10ns至1μs,工作频率范围为500kHz至单脉冲。特别是,不锈钢的冲击钻被证明显示出工艺质量和速度的提高。这些配置文件提供了高度的灵活性,并优化了解决最终应用程序特定性的过程。动态脉冲技术使同一MOPA光纤激光器可用于多种材料以及不同的过程,例如打标,钻孔,划线和雕刻。本研究中使用的脉冲光纤激光器是Multiwave Photonics的MOPA-DY。它基于调制的种子激光器,其后是一系列的光纤放大器,并以光学隔离的准直仪结束。这种脉冲激光模型的输出方式是,每个触发器都会产生一个快速脉冲脉冲,其重复频率在几十兆赫兹量级内。在突发内,可以更改脉冲数,单个脉冲轮廓,突发脉冲周期,甚至可以生成非周期性突发脉冲间隔。激光为所有这些组合提供了完全的自由度。此处的研究报告比较了脉冲峰值功率,脉冲串内的脉冲数和脉冲脉冲串周期对过程质量(热影响区,碎屑,孔的均匀性)和钻孔产量的影响。

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