The Study of Hot Embossing and Bonding Machine for Microfludic Chips Fabrication

摘要

With the development of science and technology, microfludic chip has become the leading edge in biochip research field, representing major development trend of micro-total analysis system (μTAS).Having features of high speed, high efficiency, low consumption etc., it possesses extensive application prospect in fields of gene analysis, disease diagnosis, drug screening etc.. Traditional microfludic chip adopts silicon slice, glass etc. materials to conduct processing with complex technique and high cost chip, thus it is not in favor of promotion and application of chip. The research on hot embossing and bonding machine for plastic microfludic chips fabrication is that to provide efficient processing machine for chip market which is expanded with each passing day. Based on present hot embossing technology of plastic microfludic chips and aimed to realize automation and batch process, the thesis conducts design research on mechanical construction of hot embossing and bonding machine for chips.