Keynote speeches

摘要

On chip interconnections are becoming a bottleneck to continue down scaling the transistor size in integrated circuits. On chip optical links have been considered as a possible solution to reduce the interconnection impact on consumption and performances for the longest interconnections in integrated circuits, for instance to provide a very high bandwidth between different cores. Low loss Si waveguides and fast photodetectors at 1.55 µm wavelength are compatible with CMOS fabrication, but high frequency and efficient lasers are still needed. The fabrication flow is based on molecular bonding of sub-wavelength thick III–V dies onto a 200 mm SOI wafer containing Si 220 nm height waveguides and grating couplers for light collection. III–V Microdisk lasers, fabricated on a 200 mm CMOS pilot line are presented in this work. In a first section, lasers are coupled to Si waveguides and different coupling schemes are investigated. In a second section, lasers are coupled at two different points to modulate their emission, through an active control of the coupling losses. The control of the emitting wavelength and the direct modulation of the laser are experimentally demonstrated. Two devices with different coupling schemes are experimentally studied, and their properties are compared.