Controllable bumps and holes fabrication on the surface of fused silica by processing bulk material with ultrashort laser pulses

摘要

Processing of bulk transparent dielectrics with ultrashort laser pulses is widely used for direct writing of waveguides, gratings, couplers and other photonics devices inside the volume of material [1]. This technique is based on the modification of bulk glass material or voids formation, which depends on processing conditions.