首页> 外文会议>OCEANS 2011 IEEE - Spain >Effect of manufacturing procedure on the miniaturized flextensional transducers (Cymbals) and hydrophone array performance
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Effect of manufacturing procedure on the miniaturized flextensional transducers (Cymbals) and hydrophone array performance

机译:制造过程对小型弯曲拉伸换能器(C片)和水听器阵列性能的影响

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This paper summarizes the effect of manufacturing procedure on the performance of an element as well as an array of cymbal type transducers. A finite element software ATILA, is used to model the cymbal element and optimized the dimension and materials based on the results. A maximum Receiving Sensitivity (RS) of −203 dB re 1V/µPa @ 1m is obtained analytically for a single element with 13mm diameter and a cavity depth of 600 micron and maximum RS of −192 dB re 1V/µPa @ 1m is obtained analytically for a single element with 19mm diameter and a cavity depth of 320 micron. Several prototypes were fabricated and tested the performances in Acoustic Test Facility at NIOT, which is National Accreditation Board of Testing and Calibration of Laboratories (NABL) certified. The RS showed a maximum value of only-182 dB re 1V/µPa @ 1m even with a preamplifier having a gain of 20dB for a 13mm cymbal array (1×5). The experimental results are matching well with modelled results for single elements. But expected array gain as per the numerical calculations were not obtained when connected elements in an array. It has been also observed that the d33 values of cymbal elements in an array should be identical to get the predicted results. Extreme care should be taken to avoid high pressure from acting upon the apex of the end caps during gluing and other stages. Special care in gluing, blanking and forming operations combined with optimum force/torque is necessary in getting good array performance.
机译:本文总结了制造过程对元件以及c型换能器阵列的性能的影响。使用有限元软件ATILA对c元件进行建模,并根据结果优化尺寸和材料。对于直径为13mm且腔深为600微米的单个元件,分析得出最大接收灵敏度(RS)为-203 dB re 1V / µPa @ 1m,通过分析得出的最大接收灵敏度为-192 dB re 1V / µPa @ 1m适用于直径为19mm,腔深为320微米的单个元件。在美国国家测试和校准实验室认可委员会(NABL)认证的NIOT的声学测试设备中,制造了几个原型并测试了其性能。即使前置放大器的13mm(阵列(1×5)的增益为20dB,RS的最大值也仅为-182 dB re 1V / µPa @ 1m(@ 1m)。实验结果与单个元素的建模结果非常吻合。但是,当连接数组中的元素时,无法获得根据数值计算得出的预期数组增益。还已经观察到,阵列中c元件的d 33 值应相同,以获得预测结果。在粘贴和其他阶段,应格外小心,以免高压作用在端盖的顶点上。为了获得良好的阵列性能,必须特别注意胶合,落料和成型操作,并结合最佳的力/扭矩。

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