A novel 10 Gb/s silicon on-chip UWB twiggy antenna for intra-package communication

摘要

A novel on-chip UWB antenna was developed by use of Si integrated circuits process of 65 nm technology for intra-package communication. Ultra-wideband characteristic was obtained by a triple twiggy dipole antenna which has 3 resonant frequencies. 10 Gb/s Gaussian monocycle pulse (GMP) data were transmitted and received between Si integrated circuit chips.