首页> 外文会议>2011 Symposium on VLSI Technology >A novel junctionless all-around-gate SONOS device with a quantum nanowire on a bulk substrate for 3D stack NAND flash memory
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A novel junctionless all-around-gate SONOS device with a quantum nanowire on a bulk substrate for 3D stack NAND flash memory

机译:一种新颖的无结全能门SONOS器件,该器件在大块基板上具有量子纳米线,用于3D堆栈NAND闪存

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A novel junctionless all-around-gate (AAG) SONOS device with a homogeneously n+-doped silicon nanowire (SiNW) is demonstrated on a bulk substrate. The diameter and gate length of the quantum-scale SiNW are 4 nm and 20 nm, respectively. A deep RIE process is developed for the formation of the SiNWs. The junctionless AAG SONOS device shows a high read current (> 10 µA), a large VT margin (> 6.5 V), a narrowed distribution of the erased VT, and improved cyclic endurance (105 cycles). Moreover, the proposed process is applied to implement vertically integrated 9-layer single-crystal SiNWs for 3D NAND.
机译:在块状衬底上展示了一种新颖的无结全能门(AAG)SONOS器件,该器件具有均匀掺杂n + 的硅纳米线(SiNW)。量子级SiNW的直径和栅极长度分别为4 nm和20 nm。为了形成SiNW,开发了深RIE工艺。无结AAG SONOS器件显示出高读取电流(> 10 µA),大V T 余量(> 6.5 V),擦除后的V T 的分布变窄,并提高了循环耐力(10 5 个循环)。而且,所提出的过程被应用于实现用于3D NAND的垂直集成的9层单晶SiNW。

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