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Characterization of junction dosage effect on NAND arrays with charge pumping method

机译:用电荷泵方法表征结剂量对NAND阵列的影响

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Reliability issues including random telegraph noise (RTN) and program disturbance in floating gate (FG) NAND strings for different junction dosages are compared. Although the initial threshold voltage (VT) distributions are similar for various source/drain (S/D) dosages, these samples exhibit different amplitudes on read current fluctuation. This current noise will induce inaccuracy in sensing level and the read margin is reduced especially for multi-level cell (MLC) operation. Moreover, the junction profile has a strong impact on program disturbance. Contrary to the behavior of global self-boosting (GSB), the VT of disturbed bits show an abnormal tail distribution under high pass gate voltage (Vpass, pgm) when junction dosage is reduced. Charge pumping technique is utilized to explore the local VT distribution around junctions. Based on our characterization results, the hot-carrier injection should be responsible for this tail distribution.
机译:比较了不同连接剂量下的可靠性问题,包括随机电报噪声(RTN)和浮栅(FG)NAND串中的程序干扰。尽管对于各种源极/漏极(S / D)剂量,初始阈值电压(V T )分布都相似,但这些样本在读取电流波动时表现出不同的幅度。该电流噪声将导致感测电平不准确,并且读取余量会降低,尤其是对于多级单元(MLC)操作而言。而且,结轮廓对程序干扰有很大的影响。与全局自增强(GSB)的行为相反,受干扰比特的V T 在高通栅极电压(V pass,pgm )时显示出异常的尾部分布。结剂量减少。利用电荷泵技术研究了结附近的局部V T 分布。根据我们的表征结果,热载流子注入应负责这种尾部分布。

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