首页> 外文会议>ASME international manufacturing science and engineering conference;MSEC2010 >MEASUREMENT OF TOOL INTERNAL TEMPERATURES IN THE TOOL-CHIP CONTACT REGION BY EMBEDDED THIN FILM MICRO THERMOCOUPLES
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MEASUREMENT OF TOOL INTERNAL TEMPERATURES IN THE TOOL-CHIP CONTACT REGION BY EMBEDDED THIN FILM MICRO THERMOCOUPLES

机译:嵌入式薄膜热电偶测量刀具-芯片接触区的刀具内部温度

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Monitoring and controlling thermomechanical parameters in tooling materials are imperative for improving the fundamental understanding, reliability and workpiece quality of material removal processes. Polycrystalline boron nitride (PCBN) tools are being used heavily in hard machining/turning. These processes are very sensitive to variation in local machining conditions at tool-workpiece interface and lack a thorough understanding of fundamental thermo-mechanical phenomena, both often leading to abrupt tool failures. Existing sensors to monitor the machining conditions are not suitable for robust process control as they are either destructively embedded and/or don't possess the necessary spatial and temporal resolution to monitor temperature during machining at the cutting tip/edge effectively.This paper presents an emerging approach for assessing dynamic temperatures in the close vicinity of the tool cutting edge. An array of 10 micro thin film micro thermocouples, fabricated using adapted semiconductor microfabrication methods, has been embedded into PCBN using a modified diffusion bonding technique. Scanning electron microscopy was performed to examine material interactions at the bonding interface and determine optimal bonding parameters. The sensors' performance is statically and dynamically characterized. They show good linearity, sensitivity and very fast response time.
机译:监测和控制工具材料中的热机械参数对于提高材料去除工艺的基本理解,可靠性和工件质量至关重要。多晶氮化硼(PCBN)工具在硬加工/车削中被大量使用。这些过程对工具-工件界面处局部加工条件的变化非常敏感,并且对基本的热机械现象缺乏透彻的了解,而这两种现象通常都会导致突然的工具故障。现有的用于监控加工条件的传感器不适合用于鲁棒的过程控制,因为它们要么被破坏性地嵌入和/或不具有必要的时空分辨率以有效地监控切削刃/边缘处的加工温度。 本文提出了一种新兴的评估刀具切削刃附近动态温度的方法。使用改进的扩散键合技术将使用改良的半导体微细加工方法制造的10个微细薄膜微热电偶阵列嵌入到PCBN中。进行了扫描电子显微镜检查,以检查键合界面处的材料相互作用并确定最佳键合参数。传感器的性能可以静态和动态地表征。它们显示出良好的线性,灵敏度和非常快的响应时间。

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