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MICROGAP COOLING TECHNIQUE BASED ON EVAPORATION OF THIN LIQUID FILMS

机译:基于薄液膜蒸发的微间隙冷却技术

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Thin and very thin (less than 10 μm) liquid films driven by a forced gas/vapor flow (stratified or annular flows), I.e. shear-driven liquid films in a narrow channel is a promising candidate for the thermal management of advanced semiconductor devices in earth and space applications. Development of such technology requires significant advances in fundamental research, since the stability of joint flow of locally heated liquid film and gas is a rather complex problem. The paper focuses on the recent progress that has been achieved by the authors through conducting experiments. Experiments with water in flat channels with height of H= 1.2-2.0 mm show that a liquid film driven by the action of a gas flow is stable in a wide range of liquid/gas flow rates. Map of isothermal flow regime was plotted and the length of smooth region was measured. Even for sufficiently high gas flow rates an important thermocapillary effect on film dynamics occurs. Scenario of film rupture differs widely for different flow regimes. It is found that the critical heat flux for a shear driven film can be 10 times higher than that for a falling liquid film, and exceeds 400 W/cm~2 in experiments with water for moderate liquid flow rates. This fact makes use of shear-driven liquid films promising in high heat flux chip cooling applications.
机译:由强制气体/蒸汽流(分层或环形流)驱动的薄且非常薄(小于10μm)的液膜,即狭窄通道中的剪切驱动液膜是在地球和太空应用中先进半导体器件的热管理的有前途的候选者。由于局部加热的液膜和气体的联合流动的稳定性是一个相当复杂的问题,因此这种技术的发展需要基础研究方面的重大进步。本文着重于作者通过进行实验所取得的最新进展。在水平高度为H = 1.2-2.0 mm的平坦通道中进行水的实验表明,由气流驱动的液膜在很宽的液/气流速范围内都是稳定的。绘制等温流态图并测量平滑区域的长度。即使对于足够高的气体流速,也会对薄膜动力学产生重要的热毛细作用。膜破裂的情况对于不同的流动方式有很大的不同。可以发现,剪切驱动薄膜的临界热通量比下落的液态薄膜的临界热通量高10倍,而在中等流量的水实验中,临界热通量超过400 W / cm〜2。这一事实利用了在高热通量芯片冷却应用中很有前途的剪切驱动液膜。

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