Process development of 17.5µm gold wire bonding on C65 low-k devices with probe marks

摘要

Today''s semiconductor industry continues to deliver high performance and cost effective solution. Copper wire bonding is one of the hot topics on low cost alternative packaging materials. However, copper wire bonding is still not fully established and it requires significant engineering effort especially on the C65 low k, wafer with probed Al bond pads. A thin gold wire compared to copper wire will be a faster, simpler and more efficient packaging solution for low k device. In this paper, we covered the wire bond development of 17.5µm gold wire on laminate package.