We demonstrate an advanced packaging approach with an embedded silicon micro-channel water cooler where the photovoltaic cell is electrically connected by a metallization on the silicon substrate. The backside of the silicon substrate contains the micro-machined fluidic channels thereby minimizing the thermal resistance compared to a state — of — the — art package. This leads to a reduced temperature drop between the photovoltaic cell and the coolant, allowing an increase in the temperature of recovered heat. A low-pressure drop split-flow fluid manifold is implemented to distribute the coolant from one single input to the micro-channel array and back from two outlet ports. A thermal resistance of 0.12 cm2K/W was demonstrated, which allows for the removal of 100W/cm2 heat (>1000 suns) at a ΔT of 12K. Direct chip attached silicon coolers enable higher overall concentration factor thereby reducing photovoltaic cell cost. An additional benefit of silicon is its inertness against corrosion and the matching thermal expansion coefficient which allows building of systems with a very long lifetime. The split flow configuration reduces pumping power to about 5% of the system photovoltaic output. More complex manifold micro-channel systems are proposed to minimize the pumping power to a level below 1% and to cool arrays of cells on a single large substrate.
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机译：我们用嵌入式硅微通道水冷却器演示了一种先进的封装方法，其中光伏电池通过硅基板上的金属化而电连接。硅基板的背面包含微加工的流体通道，因此与现有技术的封装相比，其热阻最小。这导致减小了光伏电池与冷却剂之间的温度下降，从而允许回收的热量的温度升高。实施低压降分流流体歧管，以将冷却剂从一个单一输入分配到微通道阵列，再从两个出口分配回去。结果表明，其热阻为0.12 cm 2 K / W，可以在ΔT为12K时除去100W / cm 2 热（> 1000太阳）。直接芯片连接的硅冷却器可实现更高的总体集中系数，从而降低光伏电池的成本。硅的另一个好处是它的抗腐蚀惰性和相称的热膨胀系数，可以构建使用寿命非常长的系统。分流配置可将泵浦功率降低至系统光伏输出的5％。提出了更复杂的歧管微通道系统，以将泵浦功率最小化到低于1％的水平，并冷却单个大基板上的电池阵列。
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