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Modeling conjugate heat transfer

机译:模拟共轭传热

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Modeling conduction heat transfer in electronic systems has gained some maturity over the past 3 decades. Although new modeling challenges were associated with 3D stacked dies or packages, some modeling approaches were proposed to handle this rather complicated multiple heat source problem. An even newer problem has started to emerge related to this growing tendency towards exploiting the vertical direction. In fact cooling becomes more and more 3D also, in the sense intermediate micro-channels are proposed going between dies and or packages. This brings convection into play aside with convection in an intimate coupling, commonly called conjugate heat transfer. It is no longer possible to treat convection as an “external” phenomenon, to be modeled by a simple external resistance. In this lecture, fundamental aspects about conjugate heat transfer are revised to obtain a realistic model that avoids large errors that could have been encountered had we treated conduction and convection separately. Fundamental concepts are revised, going up to the notion of heat transfer coefficient in order to elaborate a better model of forced convection in its most general form. The new modeling strategy will build upon progress already realized in Compact Thermal Models (CTM) for conduction in complicated electronic systems. Advanced conduction CTM will be generalized to include convection as well. This will allow a better modeling of convection, but more important a homogeneous and coherent modeling of conjugate heat transfer. Cooling of electronic systems is continuously raising new challenges not only for innovative solutions, but also for modeling of new atypical cases. The higher frequency we ask for, the greater number of functionalities we require as well, both tend to increase heat flux densities to unprecedented levels in industrial applications. Densities higher than those of a nuclear reactor were already realized in electronic systems. We are heading towar--ds densities of rocket nozzle. Complexity related to these high heat fluxes has many origins that will be addressed, in order to motivate subsequent discussions. A summary of recent advances in conduction modeling will be given before generalizing them to convection. Conjugate convection will be studied.
机译:在过去的30年中,对电子系统中的传导热传递进行建模已经获得了一些成熟。尽管新的建模挑战与3D堆叠管芯或封装相关,但仍提出了一些建模方法来处理这个相当复杂的多热源问题。与这种利用垂直方向的日益增长的趋势有关的新问题已经开始出现。实际上,冷却也越来越多地成为3D,从某种意义上说,建议在管芯和/或封装之间使用中间微通道。这将对流与紧密耦合中的对流一起发挥作用,通常称为共轭传热。通过简单的外部阻力可以将对流视为“外部”现象,这不再可能。在本讲座中,对共轭传热的基本方面进行了修改,以获得一个实际的模型,该模型避免了我们分别处理传导和对流时可能遇到的大误差。对基本概念进行了修改,直至传热系数的概念,以便以其最一般的形式阐述一个更好的强迫对流模型。新的建模策略将建立在紧凑热模型(CTM)中已经实现的,用于复杂电子系统中传导的进步的基础上。先进的传导CTM也将被概括为包括对流。这将允许更好地对流建模,但更重要的是对共轭传热进行均匀一致的建模。电子系统的冷却不仅为创新解决方案,而且还在为新的非典型案例建模提供了新的挑战。我们要求的频率越高,我们也就需要更多的功能,这两者都倾向于将热通量密度提高到工业应用中前所未有的水平。在电子系统中已经实现了比核反应堆更高的密度。我们正走向战争- -- ds火箭喷嘴的密度。与这些高热通量相关的复杂性有许多起源可以解决,以激发随后的讨论。在将传导模型概括为对流之前,将概述传导模型的最新进展。共轭对流将被研究。

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