SCCF — System to component level correlation factor

摘要

As a first step towards correlation of system level ESD robustness based on component level ESD results, on-wafer Human Metal Model (HMM) measurements are compared with on-wafer HBM for a wide range of devices in various process technologies. A device level System to Component level Correlation Factor (SCCF) is defined and can range from 10 to 150 % based upon physical failure mechanisms. Five main categories are defined independent of process technology.