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Simulation of temperature field in selective laser sintering of copper powder

机译:铜粉选择性激光烧结过程中温度场的模拟

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The 3-D transient temperature field in selective laser sintering of copper powder were simulated by ANSYS finite element software. The moving Gauss heat resource is achieved by ANSYS Parametric Design Language (APDL). The results show that when the power is constant, with the decrease of the scanning speed, the heat is easier to concentrate, and the temperature is higher. The depth and width of molten pool are obtained with different scanning speeds (v=0.06m/s, 0.12m/s and 0.18m/s) from single-layer to multi-layer sintering. The surface quality of single sintering layer is better with slow scanning speed. Otherwise, the quality of multi- sintered layer is better with high scanning speed, which is consistent with the experimental results.
机译:利用ANSYS有限元软件模拟了铜粉选择性激光烧结过程中的三维瞬态温度场。高斯运动的热量资源是通过ANSYS参数设计语言(APDL)实现的。结果表明,当功率恒定时,随着扫描速度的降低,热量更容易聚集,温度更高。从单层烧结到多层烧结,以不同的扫描速度(v = 0.06m / s,0.12m / s和0.18m / s)获得熔池的深度和宽度。单层烧结层的表面质量较好,扫描速度较慢。否则,以较高的扫描速度,多层烧结层的质量会更好,这与实验结果是一致的。

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